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2019-06-18 11:20am
학회 논문지
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발간년도 : [2019]

 
논문정보
논문명(한글) [Vol.14, No.2] A Study on Embedded System for Multipath Breakage Detection
논문투고자 Byung-Mo Kang, Byoung-Chan Jeon, In-Sik Hong
논문내용 In the era of the 4th industrial revolution, Smart City is being developed along with the Internet, which is one of the core technologies. With the expansion of Smart City, there is a growing interest in the construction, management and maintenance of IT infrastructure facilities that make up Smart City. Smart City network infrastructure is an important solution to improve the high level of social and urban economic power where people and things are always connected. Therefore, the introduction of Smart City is rapidly increasing worldwide. In addition, maintenance and management systems for infrastructure facilities are being developed and applied. Among the various monitoring technologies, SmartSheet is applied to facilities buried underground and is used for protection and monitoring of facilities. The smart sheet is used for detecting and monitoring various breakdowns by judging the abnormality by communication between the sheets. We could measure the damage location by using the special pipe equipment and TDR equipment which was developed during the monitoring technology. However, there is a disadvantage that high cost and near measurement are impossible. In order to solve these drawbacks, a monitoring system using a low-cost embedded board has been developed, but there is a disadvantage in that a measurement error and a durability problem occur due to the SW error of the embedded board. In this paper, we propose a multipath monitoring system to solve the problem of system failure and measurement problem in the existing monitoring system using the low-impedance embedded board and the impedance characteristics between the time constant and the voltage. The proposed system monitors the problems of S/W and H/W by applying the features of the fault tolerant system and can easily perform maintenance in the event of a problem.
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   14-2-09.pdf (2.7M) [3] DATE : 2019-05-05 10:13:54